Patent Assignment
Reel/Frame 063854/0751
Assignment of Assignor's Interest
Recorded: 2023-06-05
Pages: 5
Assignors
HUANG, CHIH-FAN
Executed: 2020-01-10
CHEN, HUI-CHI
Executed: 2020-01-20
LI, CHIH-SHENG
Executed: 2020-01-31
LU, CHIH-HUNG
Executed: 2020-01-31
CHEN, DIAN-HAU
Executed: 2020-01-10
CHEN, YEN-MING
Executed: 2020-01-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Having a Metal Pad and a Protective Layer for Corrosion Prevention Due to Exposure to Halogen