Patent Assignment
Reel/Frame 063860/0732
Assignment of Assignor's Interest
Recorded: 2023-06-06
Pages: 5
Assignors
SU, LIANG-YU
Executed: 2023-05-31
CHU, FU-YU
Executed: 2023-05-31
LEI, MING-TA
Executed: 2023-06-02
LIU, RUEY-HSIN
Executed: 2023-05-31
JONG, YU-CHANG
Executed: 2023-05-31
YANG, NAN-YING
Executed: 2023-05-31
CHIANG, PO-YU
Executed: 2023-05-31
WEI, YU-TING
Executed: 2023-05-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device with Enhanced Avalanche Ruggedness
Application:
18/312,819 →
Publication:
US 2024/0371926