Patent Assignment
Reel/Frame 063876/0390
Assignment of Assignor's Interest
Recorded: 2023-06-07
Pages: 4
Assignors
LAI, CHIEH-LUNG
Executed: 2023-06-04
LIN, MENG-LIANG
Executed: 2023-06-04
CHEN, HSIEN-WEI
Executed: 2023-06-04
JENG, SHIN-PUU
Executed: 2023-06-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Semiconductor Device Including Stress Control Layer and Methods of Forming the Same