IP Library › Assignment 063878/0974
Patent Assignment
Reel/Frame 063878/0974

Assignment of Assignor's Interest

Recorded: 2023-06-07 Pages: 4
Assignor
HU, SIPING
Executed: 2020-04-16
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, 430074, CHINA
Covered Properties (2)
Metal-Dielectric Bonding Method and Structure
Application: 17/658,902 →
Publication: US 2022/0238479
Metal-Dielectric Bonding Method and Structure
Application: 17/941,461 →
Publication: US 2023/0005876
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 9, 2022
From: HU, SIPING
To: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
Reel/Frame 061046/0713 →