Patent Assignment
Reel/Frame 063921/0375
Assignment of Assignor's Interest
Recorded: 2023-06-12
Pages: 7
Assignors
VAIS, ABHITOSH
Executed: 2023-06-05
PARVAIS, BERTRAND
Executed: 2023-06-05
BOCCARDI, GUILLAUME
Executed: 2023-06-05
KUNERT, BERNARDETTE
Executed: 2023-06-06
MOLS, YVES
Executed: 2023-06-06
YADAV, SACHIN
Executed: 2023-06-06
Assignee
IMEC VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method for Producing a Semiconductor Chip
Application:
18/328,182 →
Publication:
US 2023/0395561