Patent Assignment
Reel/Frame 063923/0035
Assignment of Assignor's Interest
Recorded: 2023-06-12
Pages: 7
Assignors
PARK, HYUNGJUN
Executed: 2023-05-17
KANG, GYUHO
Executed: 2023-05-18
BAE, SEONG-HOON
Executed: 2023-05-22
OH, SANG-HYUCK
Executed: 2023-05-18
JEONG, KWANGOK
Executed: 2023-05-18
CHOI, JU-IL
Executed: 2023-05-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Redistribution Substrate, Semiconductor Package Including the Same, and Method of Fabricating Redistribution Substrate