Patent Assignment
Reel/Frame 063939/0032
Assignment of Assignor's Interest
Recorded: 2023-06-13
Pages: 5
Assignors
MIYATA, YUSUKE
Executed: 2023-05-16
SUZUKI, KENJI
Executed: 2023-05-18
HARAGUCHI, YUKI
Executed: 2023-05-17
MINAMITAKE, HARUHIKO
Executed: 2023-05-16
HOSHI, TAIKI
Executed: 2023-05-16
KOKETSU, HIDENORI
Executed: 2023-05-16
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device, Method of Manufacturing Semiconductor Device, and Power Conversion Device
Application:
18/334,284 →
Publication:
US 2024/0072124