Patent Assignment
Reel/Frame 063940/0319
Assignment of Assignor's Interest
Recorded: 2023-06-13
Pages: 4
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Backside Illuminated Image Sensor Structure Including Light Pipe Structure and Manufacturing Method Thereof