IP Library › Assignment 063954/0700
Patent Assignment
Reel/Frame 063954/0700

Assignment of Assignor's Interest

Recorded: 2023-06-15 Pages: 8
Assignors
CHENG, CHIAO-YANG
Executed: 2023-05-31
TSENG, CHI-YAO
Executed: 2023-05-31
LE, THI-YEN THU
Executed: 2023-05-31
Assignee
HUA HSU SILICON MATERIALS CO., LTD.
NO. 8, GONGYEQU 10TH RD., XIEHE VIL., XITUN DIST., TAICHUNG CITY, TAIWAN
Covered Property (1)
Method for Wafer Treatment
Application: 18/210,077 →
Publication: US 2024/0420946
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2025
From: JENQ, MUH-GUENG; LIN, YUNG-HSIANG
To: HUA HSU SILICON MATERIALS CO., LTD.
Reel/Frame 071751/0708 →
Change of Name Dec 4, 2025
From: HUA HSU SILICON MATERIALS CO., LTD.
To: HUA HSU ADVANCED TECHNOLOGY CO., LTD.
Reel/Frame 073108/0363 →