IP Library Assignment 071751/0708
Patent Assignment
Reel/Frame 071751/0708

Assignment of Assignor's Interest

Recorded: 2025-07-18 Pages: 5
Assignors
JENQ, MUH-GUENG
Executed: 2025-06-23
LIN, YUNG-HSIANG
Executed: 2025-06-23
Assignee
HUA HSU SILICON MATERIALS CO., LTD.
NO. 8, GONGYEQU 10TH RD., XIEHE VIL., XITUN DIST., TAICHUNG CITY, TAIWAN
Covered Property (1)
Method for Wafer Treatment
Application: 18/210,077 →
Publication: US 2024/0420946
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 15, 2023
From: CHENG, CHIAO-YANG; TSENG, CHI-YAO; LE, THI-YEN THU
To: HUA HSU SILICON MATERIALS CO., LTD.
Reel/Frame 063954/0700 →
Change of Name Dec 4, 2025
From: HUA HSU SILICON MATERIALS CO., LTD.
To: HUA HSU ADVANCED TECHNOLOGY CO., LTD.
Reel/Frame 073108/0363 →