Patent Assignment
Reel/Frame 063965/0517
Assignment of Assignor's Interest
Recorded: 2023-06-15
Pages: 3
Assignor
DUNGAN, THOMAS EDWARD
Executed: 2021-05-10
Assignee
BROADCOM INTERNATIONAL PTE. LTD.
1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Property
(1)
Copper-Bonded Memory Stacks with Copper-Bonded Interconnection Memory Systems
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.