IP Library › Assignment 064005/0464
Patent Assignment
Reel/Frame 064005/0464

Merger

Recorded: 2023-06-15 Pages: 37
Assignors
BROADCOM INTERNATIONAL PTE. LTD.
Executed: 2023-02-02
Assignee
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Property (1)
Copper-Bonded Memory Stacks with Copper-Bonded Interconnection Memory Systems
Application: 18/335,578 →
Publication: US 2023/0343771
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 15, 2023
From: DUNGAN, THOMAS EDWARD
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 063965/0517 →