Patent Assignment
Reel/Frame 064004/0426
Assignment of Assignor's Interest
Recorded: 2023-06-21
Pages: 2
Assignor
SUGITA, NORIAKI
Executed: 2023-06-13
Assignee
NITTA DUPONT INCORPORATED
4-26, SAKURAGAWA 4-CHOME, NANIWA-KU, OSAKA-SHI, OSAKA, 5560022, JAPAN
Covered Property
(1)
Polishing Composition and Method of Polishing Silicon Wafer