Patent Assignment
Reel/Frame 064051/0770
Assignment of Assignor's Interest
Recorded: 2023-06-25
Pages: 2
Assignor
SHEN, YUCI
Executed: 2023-06-25
Assignee
IC CHIP COOLING TECHNOLOGIES LLC
1401 21ST STREET SUITE 8218, ATTN: YUCI SHEN, SACRAMENTO, CALIFORNIA, 95811
Covered Property
(1)
Package Aspect of Heat-Dissipating Lid and Reservoir Structure for Liquid Thermal Interfacing Materials