Package aspect of heat-dissipating lid and reservoir structure for liquid thermal interfacing materials
View Patent ↗The disclosure describes a heat-dissipating object having a reservoir structure so that a reservoir system can be formed in an electronic device, allowing for a liquid TIM in the gap between the heat-dissipating object and the heat-generating object of the electronic device. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a space for taking in a liquid material and releasing it again when needed. As a specific case of the heat-dissipating object and the electronic device, a lid having a reservoir structure and a lidded flip chip package based on the lid are particularly described in details of the embodiments of the present invention.
1. A lidded flip chip package with a liquid thermal interface material (TIM), comprising,
a flip chip, a substrate having a top surface and a bottom surface, a lid including a top piece having a top surface and a bottom surface and a side wall, and a reservoir system, comprising a sealed gap, a reservoir, a connecting hole and a liquid material,
wherein the flip chip is attached on the top surface of the substrate, forming a flip chip package, the lid is attached on the substrate by using an adhesive to bond its side wall onto a peripheral region of the top surface of the substrate, therein covering the flip chip and forming a gap between the flip chip and the top piece of the lid;
wherein the top piece of the lid has a slot on its bottom surface, a seal ring is mounted in the slot, the seal ring directly seals the gap between the flip chip and the lid along its peripheral region, forming the sealed gap,
wherein the reservoir is a space in the top piece of the lid and around the seal ring, having an inlet and an outlet, a connecting hole has an end at a portion of the bottom surface of the top piece surrounded by the seal ring and another end connecting to the inlet of the reservoir, and the outlet of the reservoir opens to an ambient,
and wherein the sealed gap is entirely filled with the liquid material, providing a liquid thermal interface material (TIM) between the lid and the flip chip, and the reservoir is partially filled with the liquid material.
2. The lidded flip chip package of claim 1 ,
wherein the reservoir is one or more tunnels.
3. The lidded flip chip package of claim 1 ,
wherein the reservoir is a spiral pattern of tunnel.
4. The lidded flip chip package of claim 1 ,
wherein the top piece of the lid comprises a reservoir layer, which is a layer of material, in which the reservoir is formed.
5. The lidded flip chip package of claim 1 ,
wherein the one or more tunnels are formed through one or more slots on the top or bottom surface of the top piece of the lid.
6. The lidded flip chip package of claim 1 ,
wherein the one or more tunnels are formed through one or more slots on the bottom surface of the top piece of the lid and around the seal ring, and wherein the lid further comprises a covering piece which is bonded on the bottom surface of the top piece of the lid for covering said one or more slots, therein forming said one or more tunnels.
7. The lidded flip chip package of claim 1 ,
wherein the one or more tunnels are formed through one or more slots on the top surface of the top piece of the lid, and wherein the lid further comprises a removable covering piece which covers said one or more slots on the top surface of the top piece of the lid, therein forming said one or more tunnels.
8. The lidded flip chip package of claim 1 ,
wherein the one or more tunnels are formed through one or more slots on the top surface of the top piece of the lid and around the seal ring, and wherein the lid further comprises a covering piece which is bonded on the top surface of the top piece of the lid for covering said one or more slots, therein forming said one or more tunnels.
9. The lidded flip chip package of claim 1 ,
wherein the flip chip is a chip module consisting of a plurality of chips.
10. The lidded flip chip package of claim 1 ,
wherein the flip chip package comprises a plurality of separate flip chips and the lid accordingly comprises a plurality of seal rings.
11. A lidded flip chip package with a liquid thermal interface material (TIM), comprising,
a flip chip, a substrate having a top surface and a bottom surface, a lid including a top piece having a top surface and a bottom surface and a side wall, and a reservoir system, comprising a sealed gap, a reservoir, a connecting hole and a liquid material,
wherein the flip chip is attached on a middle region of the top surface of the substrate, forming a flip chip package, the lid is attached on the substrate by using an adhesive to bond its side wall onto a peripheral region of the top surface of the substrate, therein covering the flip chip and forming a gap between the flip chip and the top piece of the lid,
wherein the top piece of the lid has a slot on its bottom surface, a seal ring is mounted in the slot, the seal ring directly seals the gap between the flip chip and the lid along its peripheral region, forming the sealed gap,
wherein the reservoir is a container outside the lid, having an inlet and an outlet, a connecting hole has an end at a portion of the bottom surface of the top piece surrounded by the seal ring and another end connecting to the inlet of the reservoir, and the outlet of the reservoir opens to the ambient,
and wherein the sealed gap is entirely filled with the liquid material, providing a liquid thermal interface material (TIM) between the lid and the flip chip, and the reservoir is partially filled with the liquid material.
12. The lidded flip chip package of claim 11 ,
wherein the container is one or more tubes.
13. The lidded flip chip package of claim 11 ,
wherein the container is a tube around the seal ring and between the top piece of the lid and the substrate.