Patent Assignment
Reel/Frame 064061/0929
Assignment of Assignor's Interest
Recorded: 2023-06-26
Pages: 10
Assignors
LEE, JAEHONG
Executed: 2023-06-13
SONG, SEUNG MIN
Executed: 2023-06-13
SEO, KANG-ILL
Executed: 2023-06-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Backside Isolation Structure and Placeholder Isolation Structure
Application:
18/214,221 →
Publication:
US 2024/0290834