Patent Assignment
Reel/Frame 064064/0350
Assignment of Assignor's Interest
Recorded: 2023-06-26
Pages: 4
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
SiC SUBSTRATE AND SiC EPITAXIAL WAFER
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.