Patent Assignment
Reel/Frame 064082/0221
Assignment of Assignor's Interest
Recorded: 2023-06-27
Pages: 3
Assignors
TSAI, YI-LIN
Executed: 2023-06-19
LIU, NAI-WEI
Executed: 2023-06-19
HSU, WEN-SUNG
Executed: 2023-06-19
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Structure
Application:
18/342,149 →
Publication:
US 2024/0038614