Patent Assignment
Reel/Frame 064213/0497
Assignment of Assignor's Interest
Recorded: 2023-07-11
Pages: 8
Assignors
KOMURO, NOBUHITO
Executed: 2020-01-30
DAIJIMA, YUTA
Executed: 2020-01-30
KOJIMA, MASAYUKI
Executed: 2020-01-30
IRIZAWA, SHINJI
Executed: 2020-01-30
OOSAKI, SHINYA
Executed: 2020-01-30
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Dry Film Using Same, Printed Wiring Board, and Printed Wiring Board Manufacturing Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
Change of Name
Mar 20, 2024
From: HITACHI CHEMICAL CO., LTD
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 066837/0196 →
Change of Name
Mar 20, 2024
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 066837/0454 →