Patent Assignment
Reel/Frame 066837/0454
Change of Name
Recorded: 2024-03-20
Pages: 10
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Dry Film Using Same, Printed Wiring Board, and Printed Wiring Board Manufacturing Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 11, 2023
From: KOMURO, NOBUHITO; DAIJIMA, YUTA; KOJIMA, MASAYUKI; IRIZAWA, SHINJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 064213/0497 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
Change of Name
Mar 20, 2024
From: HITACHI CHEMICAL CO., LTD
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 066837/0196 →