Patent Assignment
Reel/Frame 064225/0474
Assignment of Assignor's Interest
Recorded: 2023-07-12
Pages: 3
Assignor
LIN, TA-CHUN
Executed: 2023-07-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming a Semiconductor Device by Recessing Semiconductor Layers and Inner Spacers
Application:
18/350,933 →
Publication:
US 2025/0022877