Patent Assignment
Reel/Frame 064251/0232
Assignment of Assignor's Interest
Recorded: 2023-05-22
Pages: 5
Assignor
ZHANG, SIRIGULENG
Executed: 2023-05-15
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
NO.18, WEN CHANG RD., ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100716, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Method for Forming Semiconductor Structure
Application:
18/038,129 →
Publication:
US 2024/0063325