Patent Assignment
Reel/Frame 064294/0706
Assignment of Assignor's Interest
Recorded: 2023-07-18
Pages: 4
Assignors
LIN, TZU-YU
Executed: 2021-06-14
ZHONG, CHIA-WEN
Executed: 2021-06-17
CHANG, YAO-WEN
Executed: 2021-08-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bottom-Electrode Interface Structure for Memory