Patent Assignment
Reel/Frame 064338/0658
Assignment of Assignor's Interest
Recorded: 2023-07-21
Pages: 3
Assignor
ZHOU, ZHI-BIAO
Executed: 2020-09-15
Assignee
UNITED MICROELECTRONICS CORP.
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Method for Manufacturing Semiconductor Module Including Piezoelectric Layer