Patent Assignment
Reel/Frame 064374/0337
Assignment of Assignor's Interest
Recorded: 2023-07-25
Pages: 7
Assignors
LEE, JOONGGEUN
Executed: 2023-05-19
JEONG, DAECHUL
Executed: 2023-05-19
BAE, JEONGYEOL
Executed: 2023-05-19
LEE, JONGSOO
Executed: 2023-05-22
YOO, SANGMIN
Executed: 2023-05-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Rf Chip to Improve Transmit Channel Flatness