Patent Assignment
Reel/Frame 064389/0735
Assignment of Assignor's Interest
Recorded: 2023-07-26
Pages: 4
Assignors
LEE, BI-SHEN
Executed: 2021-07-13
WEI, YI YANG
Executed: 2021-07-15
TRINH, HAI-DANG
Executed: 2021-07-16
KUANG, HSUN-CHUNG
Executed: 2021-07-13
TSAI, CHENG-YUAN
Executed: 2021-07-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interface Film to Mitigate Size Effect of Memory Device