Patent Assignment
Reel/Frame 064396/0816
Assignment of Assignor's Interest
Recorded: 2023-07-27
Pages: 4
Assignors
TOBA, MASAYA
Executed: 2023-07-08
MITSUKURA, KAZUYUKI
Executed: 2023-07-16
YAMAGUCHI, MASAKI
Executed: 2023-07-04
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Layered Plate and Wiring Base Board Production Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.