Patent Assignment
Reel/Frame 064397/0727
Assignment of Assignor's Interest
Recorded: 2023-07-27
Pages: 6
Assignors
LIN, YU-SHENG
Executed: 2020-11-17
JENG, SHIN-PUU
Executed: 2020-11-17
LIN, PO-YAO
Executed: 2020-11-17
WANG, CHIN-HUA
Executed: 2020-11-17
YEH, SHU-SHEN
Executed: 2020-11-17
YANG, CHE-CHIA
Executed: 2020-12-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with Underfill