Package structure with underfill
A package structure is provided. The package structure includes a substrate having interior sidewalls forming a recess. The interior sidewalls have an upper sidewall, a lower sidewall, and an intermediate sidewall. The intermediate sidewall is between the upper sidewall and the lower sidewall. The upper sidewall, the lower sidewall, and the intermediate sidewall have different slopes. The package structure also includes a chip-containing structure over the substrate. A component of the chip-containing structure is partially or completely surrounded by the interior sidewalls.
1. A package structure, comprising:
a substrate having interior sidewalls forming a recess, wherein the interior sidewalls have an upper sidewall, a lower sidewall, and an intermediate sidewall, the intermediate sidewall is between the upper sidewall and the lower sidewall, and the upper sidewall, the lower sidewall, and the intermediate sidewall have different slopes; and
a chip-containing structure over the substrate, wherein a component of the chip-containing structure is at least partially surrounded by the interior sidewalls, the chip-containing structure has a redistribution structure and a chip structure, the component and the chip structure are disposed over opposite surfaces of the redistribution structure, and the redistribution structure has a plurality of polymer-containing layers and a plurality of conductive features.
2. The package structure as claimed in claim 1 , wherein the chip-containing structure further has a second chip structure laterally spaced apart from the chip structure, the component extends across opposite sidewalls of the chip structure and the second chip structure, and the chip structure and the second chip structure together extend across opposite sidewalls of the component.
3. The package structure as claimed in claim 2 , wherein the component is an interconnection chip, and the interconnection chip forms electrical connections between the first chip structure and the second chip structure.
4. The package structure as claimed in claim 3 , wherein the component has no active device.
5. The package structure as claimed in claim 1 , wherein the lower sidewall is steeper than the intermediate sidewall.
6. The package structure as claimed in claim 5 , wherein the intermediate sidewall is steeper than the upper sidewall.
7. The package structure as claimed in claim 1 , further comprising:
an underfill structure filling the recess.
8. The package structure as claimed in claim 7 , further comprising:
a plurality of tin-containing bonding structures between the substrate and the chip-containing structure, wherein the underfill structure laterally surrounds the tin-containing bonding structures.
9. The package structure as claimed in claim 1 , wherein the upper sidewall is at a first angle to the vertical, the lower sidewall is at a second angle to the vertical, the first angle is in a range from about 30 degrees to about 60 degrees, and a ratio of the first angle to the second angle is in a range from about 2 to about 4.
10. The package structure as claimed in claim 1 , wherein the intermediate sidewall is steeper than the upper sidewall, the lower sidewall is steeper than the intermediate sidewall, and the intermediate sidewall is in direct contact with the upper sidewall and the lower sidewall.
11. A package structure, comprising:
a substrate having interior sidewalls forming a recess, wherein the interior sidewalls have an upper sidewall, a lower sidewall, and an intermediate sidewall, and the intermediate sidewall is between the upper sidewall and the lower sidewall, wherein the substrate has a first surface and a second surface opposite to the first surface, the recess extends from the first surface towards the second surface, and the upper sidewall is between the intermediate sidewall and the first surface, wherein the upper sidewall is at a first acute angle to a vertical substantially perpendicular to the second surface, the intermediate sidewall is at a second acute angle to the vertical, the lower sidewall is at a third acute angle to the vertical, the first acute angle is larger than the second acute angle, and the second acute angle is larger than the third acute angle; and
a chip-containing structure over the substrate, wherein a component of the chip-containing structure enters the recess.
12. The package structure as claimed in claim 11 , wherein the chip-containing structure has a second component entering the recess.
13. The package structure as claimed in claim 12 , wherein the chip-containing structure has a first chip structure and a second chip structure laterally spaced apart from the first chip structure, the component extends across opposite sidewalls of the first chip structure and the second chip structure, and the second component extends across the opposite sidewalls of the first chip structure and the second chip structure.
14. The package structure as claimed in claim 13 , wherein the chip-containing structure has a redistribution structure, the component and the first chip are disposed over opposite surfaces of the redistribution structure, the second component and the second chip structure are disposed over the opposite surfaces of the redistribution structure, and the redistribution structure has a plurality of insulating layers and a plurality of conductive features.
15. The package structure as claimed in claim 11 , wherein the chip-containing structure extends across outermost edges of the recess.
16. A package structure, comprising:
a substrate having a recess, wherein the recess has an upper sidewall, a lower sidewall, and an intermediate sidewall, the intermediate sidewall is between the upper sidewall and the lower sidewall, and the lower sidewall is steeper than the upper sidewall;
a chip-containing structure over the substrate, wherein a component of the chip-containing structure enters the recess, wherein the chip-containing structure extends across outermost edges of the recess; and
an underfill structure overfilling the recess and covering an entirety of a bottom surface of the component.
17. The package structure as claimed in claim 16 , wherein the intermediate sidewall and the lower sidewall have different slopes.
18. The package structure as claimed in claim 16 , wherein the chip-containing structure has a first chip structure and a second chip structure laterally spaced apart from the first chip structure, the component extends across opposite sidewalls of the first chip structure and the second chip structure.
19. The package structure as claimed in claim 18 , wherein the chip-containing structure has a second component extending across the opposite sidewalls of the first chip structure and the second chip structure.
20. The package structure as claimed in claim 19 , wherein the chip-containing structure has a redistribution structure, the component and the first chip are disposed over opposite surfaces of the redistribution structure, the second component and the second chip structure are disposed over the opposite surfaces of the redistribution structure, and the redistribution structure has a plurality of insulating layers and a plurality of conductive features.