Patent Assignment
Reel/Frame 064408/0462
Assignment of Assignor's Interest
Recorded: 2023-07-27
Pages: 7
Assignors
CHOI, JAE SEUNG
Executed: 2023-07-12
KIM, BYUNG-SU
Executed: 2023-07-12
PARK, BONG IL
Executed: 2023-07-12
KWAK, CHANG SEOK
Executed: 2023-07-12
PARK, SUN HEE
Executed: 2023-07-12
CHEON, SANG JOON
Executed: 2023-07-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO,, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Integrated Circuit Device Including Inter-Die Interface