Patent Assignment
Reel/Frame 064417/0916
Assignment of Assignor's Interest
Recorded: 2023-07-27
Pages: 5
Assignors
BRIGGS, BENJAMIN DAVID
Executed: 2016-06-30
CLEVENGER, LAWRENCE A.
Executed: 2016-06-30
DEPROSPO, BARTLET H.
Executed: 2016-06-30
HUANG, HUAI
Executed: 2016-06-30
PENNY, CHRISTOPHER J.
Executed: 2016-06-30
RIZZOLO, MICHAEL
Executed: 2016-06-30
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
1 NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Semiconductor Device Including a Porous Dielectric Layer, and Method of Forming the Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest
Jul 27, 2023
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 064408/0469 →
Change of Name
Jul 27, 2023
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 064417/0921 →
Change of Name
Jul 27, 2023
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 064418/0069 →