Patent Assignment
Reel/Frame 064434/0893
Assignment of Assignor's Interest
Recorded: 2023-07-31
Pages: 5
Assignors
LEE, YUNG-YAO
Executed: 2020-07-06
HU, CHENG-KANG
Executed: 2020-07-06
PENG, JUI-CHUN
Executed: 2020-07-06
LIU, HSU-SHUI
Executed: 2020-07-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Wafer Cooling