Patent Assignment
Reel/Frame 064439/0015
Assignment of Assignor's Interest
Recorded: 2023-07-31
Pages: 3
Assignors
JI, YUNJE
Executed: 2023-07-13
KIM, YONGHOON
Executed: 2023-07-13
LEE, SEUNGEUN
Executed: 2023-07-13
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Circuit Board and Manufacturing Method Thereof
Application:
18/228,160 →
Publication:
US 2024/0172358