Patent Assignment
Reel/Frame 064481/0695
Assignment of Assignor's Interest
Recorded: 2023-08-03
Pages: 3
Assignor
SHIH, HUNG-LING
Executed: 2020-03-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Profile of Deep Trench Isolation Structure for Isolation of High-Voltage Devices