Patent Assignment
Reel/Frame 064499/0526
Assignment of Assignor's Interest
Recorded: 2023-08-04
Pages: 4
Assignors
TSAO, WEI-AN
Executed: 2023-07-31
WU, CHEN YU
Executed: 2023-07-31
WANG, PO-HAN
Executed: 2023-07-31
HU, YU-HSIANG
Executed: 2023-07-31
KUO, HUNG-JUI
Executed: 2023-08-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Packages and Methods of Forming the Same
Application:
18/365,756 →
Publication:
US 2024/0379565