Patent Assignment
Reel/Frame 064522/0066
Assignment of Assignor's Interest
Recorded: 2023-08-08
Pages: 3
Assignors
LEE, JONG HO
Executed: 2023-05-13
CHA, KYOUNG JIN
Executed: 2023-05-13
CHA, BERM HA
Executed: 2023-05-13
CHOI, HYUNG JONG
Executed: 2023-05-13
CHUN, JIN WOO
Executed: 2023-05-13
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component