Patent Assignment
Reel/Frame 064539/0119
Assignment of Assignor's Interest
Recorded: 2023-08-09
Pages: 4
Assignor
NAKATANI, KIMIHIKO
Executed: 2020-02-14
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Method, Substrate Processing Apparatus, and Recording Medium