Patent Assignment
Reel/Frame 064550/0211
Assignment of Assignor's Interest
Recorded: 2023-08-10
Pages: 5
Assignors
CHEN, YU-HAO
Executed: 2021-07-04
WENG, CHUNG-MING
Executed: 2021-07-04
YU, TSUNG-YUAN
Executed: 2021-07-04
LEE, HUI YU
Executed: 2021-07-02
KUO, HUNG-YI
Executed: 2021-07-12
KUAN, JUI-FENG
Executed: 2021-07-05
WU, CHIEN-TE
Executed: 2021-07-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Making Semiconductor Device Including Optical Through via and Method of Using
Application:
18/358,790 →
Publication:
US 2023/0384537