Patent Assignment
Reel/Frame 064551/0149
Assignment of Assignor's Interest
Recorded: 2023-08-10
Pages: 6
Assignors
LEE, SOHYEON
Executed: 2023-08-03
CHANG, SEONGPIL
Executed: 2023-08-07
LEE, SEA HOON
Executed: 2023-08-07
LEE, JAEDUK
Executed: 2023-08-01
LEE, TACKHWI
Executed: 2023-08-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Vertical Nonvolatile Memory Device Having Hydrogen Diffusion Barrier Layer and Manufacturing Method Thereof
Application:
18/446,911 →
Publication:
US 2024/0130133