Patent Assignment
Reel/Frame 064555/0873
Assignment of Assignor's Interest
Recorded: 2023-08-10
Pages: 4
Assignors
CHIU, WEI-CHAO
Executed: 2021-05-02
CHEN, YU-WEN
Executed: 2021-05-03
LIOU, YONG-JIN
Executed: 2021-05-03
CHANG, CHUN-WEI
Executed: 2021-05-31
KUO, CHING-SEN
Executed: 2021-05-02
SHIU, FENG-JIA
Executed: 2021-05-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Techniques for Forming a Deep Trench Isolation Structure Between Photodiodes by Forming a First Set of Trenches Based on a First Pattern and Forming a Second Set of Trenches Based on a Second Pattern