Patent Assignment
Reel/Frame 064557/0887
Assignment of Assignor's Interest
Recorded: 2023-08-10
Pages: 5
Assignors
FANG, SHANG-WEI
Executed: 2020-12-31
SIO, KAM-TOU
Executed: 2020-12-29
LIN, WEI-CHENG
Executed: 2020-12-30
TZENG, JIANN-TYNG
Executed: 2020-12-31
LU, LEE-CHUNG
Executed: 2020-11-04
CHENG, YI-KAN
Executed: 2020-12-30
WANG, CHUNG-HSING
Executed: 2020-12-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Having Hybrid Sheet Structure