Patent Assignment
Reel/Frame 064606/0437
Assignment of Assignor's Interest
Recorded: 2023-08-16
Pages: 7
Assignors
PARK, WON JI
Executed: 2023-08-08
KIM, SUNOO
Executed: 2023-08-08
OH, JAEHEE
Executed: 2023-08-08
KIM, HYUNGWON
Executed: 2023-08-08
JANG, WOOSEONG
Executed: 2023-08-08
KIM, TAEKYUNG
Executed: 2023-08-08
HYUN, YOUNGBIN
Executed: 2023-08-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Logic Device and Manufacturing Method Thereof
Application:
18/234,517 →
Publication:
US 2024/0275387