Patent Assignment
Reel/Frame 064609/0923
Assignment of Assignor's Interest
Recorded: 2023-08-16
Pages: 4
Assignors
CHEN, YI-WEN
Executed: 2023-05-12
CHOU, WEN-CHUNG
Executed: 2023-05-12
TUNG, I-HSIN
Executed: 2023-05-12
Assignee
LIGITEK ELECTRONICS CO., LTD.
NO. 238, BO-AI STREET, SHULIN DISTRICT, NEW TAIPEI CITY, TAIWAN
Covered Property
(1)
Touch Light-Emitting Module Having Hollowed Portion for Incapsulation Resin and Manufacturing Method Thereof