Touch light-emitting module having hollowed portion for incapsulation resin and manufacturing method thereof
A touch light-emitting module and a manufacturing method thereof are disclosed. The touch light-emitting module includes a printed circuit board and a touch-control conductor. The printed circuit board has a top surface on which a touch-control IC and a luminous unit that is electrically connected are disposed. The touch-control conductor includes a hollowed portion. The touch-control conductor is coated, on the bottom thereof, with a conductive material to combine with the top surface of the printed circuit board, so that the touch-control IC and the luminous unit are located in the hollowed portion. An encapsulation resin is then injected into a space between the printed circuit board and the hollowed portion to complete encapsulation. As such, the present invention offers a simplified structure to achieve an effect of minimization, and also simplifies the manufacturing process and reduces the working time to thereby enhance the yield.
1. A touch light-emitting module, comprising:
a printed circuit board, the printed circuit board having a top surface on which a touch-control integrated circuit (IC) and at least one luminous unit in electrical connection with the touch-control IC are disposed; and
a touch-control conductor combined with the printed circuit board through a conductive material, the touch-control conductor being formed with a hollowed portion in which the touch-control IC and the luminous unit are located, the hollowed portion receiving an encapsulation resin to inject therein to form encapsulation of the touch light-emitting module;
wherein the touch-control conductor is formed of a plurality of copper-foil layers and at least one insulator layer that are alternately stacked on each other, and the touch-control conductor comprises an electrically conductive body, the electrically conductive body being arranged to connect, in a direction of the stacking, at least two of the copper-foil layers and the insulator layer between the copper-foil layers to establish electrical connection between the copper-foil layers.
2. The touch light-emitting module according to claim 1 , wherein the top surface of the printed circuit board is formed with a recessed portion that corresponds, in shape, to the hollowed portion, and the touch-control IC and the luminous unit are disposed in the recessed portion.
3. The touch light-emitting module according to claim 2 , wherein the recessed portion comprises a function zone on which the touch-control IC and the luminous unit are disposed and a circumferential groove that surrounds an outer circumference of the function zone.
4. The touch light-emitting module according to claim 3 , wherein a raised rib is arranged between the function zone and the circumferential groove.
5. The touch light-emitting module according to claim 2 , wherein the touch-control conductor and the printed circuit board are arranged coaxial with each other, and a spacing distance of around 0.05-0.5 mm is formed between a sidewall of the recessed portion and a sidewall of the hollowed portion.
6. The touch light-emitting module according to claim 1 , wherein the touch-control conductor comprises a plurality of electrically conductive zones, and the electrically conductive zones are combined with the printed circuit board by the conductive material, the electrically conductive zones being in a state of non-contacting with each other.
7. The touch light-emitting module according to claim 6 , wherein the electrically conductive zones are formed of the plurality of copper-foil layers and at least one insulator layer that are alternately stacked on each other, and the electrically conductive zones comprise the electrically conductive body.
8. The touch light-emitting module according to claim 1 , wherein the touch-control conductor has a width of around 0.3-2 cm.
9. The touch light-emitting module according to claim 1 , wherein the printed circuit board comprises an outer flange that is formed as a stepped structure.
10. The touch light-emitting module according to claim 1 , wherein the top surface of the printed circuit board further comprises a logic control IC disposed thereon, and the logic control IC is in electrical connection with the touch-control IC and the luminous unit.
11. The touch light-emitting module according to claim 1 , wherein a metallic pad is arranged on the touch-control conductor.
12. The touch light-emitting module according to claim 1 , further comprising an upper cover, the upper cover being mounted at a top of the touch-control conductor and electrically connected with the touch-control conductor, edges of the upper cover extending beyond a perimeter of the touch-control conductor and a perimeter of the printed circuit board, the upper cover being formed with a through-hole, the through-hole communicating with the hollowed portion of the touch-control conductor, wherein in a top view of the touch light-emitting module, a perimeter of the through-hole enclosing a perimeter of the hollowed portion.
13. The touch light-emitting module according to claim 12 , wherein an area of a bottom surface of the upper cover where the upper cover is not in contact with the touch conductor is provided with a plural of support members.
14. The touch light-emitting module according to claim 1 , further comprising a reflector case and a sensing electrode, the reflector case being mounted on the printed circuit board and cover the touch-control conductor, the sensing electrode being mounted on the reflector case and having a connection portion, the reflector case and the sensing electrode respectively having a through-hole, the through-hole on the reflector case and the through-hole on the sensing electrode communicating with each other and being arranged such that the light from the luminous unit passes therethrough and emits out from a top of the touch light-emitting module.
15. A touch light-emitting module manufacturing method, comprising:
disposing a touch-control integrated circuit (IC) and at least one luminous unit on a top surface of a printed circuit board;
coating a conductive material on a bottom surface of a touch-control conductor that is formed with a hollowed portion for combination with the top surface of the printed circuit board such that the touch-control IC and the luminous unit are located in the hollowed portion; and
injecting an encapsulation resin into a space between the printed circuit board and the hollowed portion to complete encapsulation;
wherein the touch-control conductor is formed by alternately stacking a plurality of copper-foil layers and at least one insulator layer, and drilling is applied to at least two of the copper-foil layers and the insulator layer between the copper-foil layers to form an electrical conduction hole, which is then filled up with electroplating to form an electrically conductive body to electrically connect the copper-foil layers.
16. The touch light-emitting module manufacturing method according to claim 15 , wherein the touch-control IC and the luminous unit are mounted on the top surface of the printed circuit board through a soldering operation, and the touch-control conductor and the printed circuit board are combined through an operation of reflow.
17. The touch light-emitting module manufacturing method according to claim 16 , wherein the printed circuit board has a width of around 0.3-2 cm.
18. The touch light-emitting module manufacturing method according to claim 15 , wherein the touch-control conductor comprises a plurality of electrically conductive zones, and the conductive material is coated on a bottom of the electrically conductive zones to have the electrically conductive zones combined with the printed circuit board in a state of non-contacting with each other.