Patent Assignment
Reel/Frame 064613/0109
Assignment of Assignor's Interest
Recorded: 2023-08-16
Pages: 3
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Wafer Bonding Process with Reduced Overlay Distortion
Application:
18/450,083 →
Publication:
US 2024/0063022