IP Library › Assignment 064624/0711
Patent Assignment
Reel/Frame 064624/0711

Assignment of Assignor's Interest

Recorded: 2023-08-17 Pages: 6
Assignors
HAQ, JESMIN
Executed: 2018-04-12
ZHONG, TOM
Executed: 2018-04-12
LAM, VINH
Executed: 2018-04-12
SUNDAR, VIGNESH
Executed: 2018-04-12
TENG, ZHONGJIAN
Executed: 2018-04-12
Assignee
HEADWAY TECHNOLOGIES, INC.
678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Mtj Device Performance by Adding Stress Modulation Layer to Mtj Device Structure
Application: 18/359,943 →
Publication: US 2023/0371398
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 17, 2023
From: HEADWAY TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 064624/0809 →