Patent Assignment
Reel/Frame 064626/0231
Assignment of Assignor's Interest
Recorded: 2023-08-17
Pages: 5
Assignors
AHN, TAEWOONG
Executed: 2023-02-15
PARK, YOUNGIN
Executed: 2023-02-16
JANG, JUNYEONG
Executed: 2023-02-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Package for Scan Testing Semiconductor Chip, Operating Method of Integrated Circuit Package, and Integrated Circuit