IP Library Assignment 064632/0085
Patent Assignment
Reel/Frame 064632/0085

Assignment of Assignor's Interest

Recorded: 2023-08-18 Pages: 3
Assignors
YANG, MICHAEL X.
Executed: 2019-05-09
PFAHLER, CHRISTIAN
Executed: 2019-05-10
COSCEEV, ALEXANDR
Executed: 2019-05-09
Assignee
MATTSON TECHNOLOGY, INC.
PO BOX 1449, GREENVILLE, SOUTH CAROLINA, 29602
Covered Property (1)
Support Plate for Localized Heating in Thermal Processing Systems
Application: 18/074,713 →
Publication: US 2023/0098442
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 17, 2023
From: YANG, MICHAEL X.
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 064626/0942 →
Assignment of Assignor's Interest Aug 17, 2023
From: BREMENSDORFER, ROLF; KEPPLER, JOHANNES; HÜLSMANN, THORSTEN
To: MATTSON THERMAL PRODUCTS, GMBH.
Reel/Frame 064626/0949 →
Assignment of Assignor's Interest Aug 17, 2023
From: MATTSON THERMAL PRODUCTS, GMBH.
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 064626/0958 →
Assignment of Assignor's Interest Aug 17, 2023
From: MATTSON TECHNOLOGY, INC.
To: BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY CO., LTD; MATTSON TECHNOLOGY, INC.
Reel/Frame 064626/0980 →