Patent Assignment
Reel/Frame 064662/0240
Assignment of Assignor's Interest
Recorded: 2023-08-22
Pages: 4
Assignors
YEH, CHIH CHIEH
Executed: 2021-01-05
LI, MING-SHUAN
Executed: 2021-01-05
WANG, CHIH-HUNG
Executed: 2021-01-05
SU, ZI-ANG
Executed: 2021-01-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method and Structure for Diodes with Backside Contacts
Application:
18/446,917 →
Publication:
US 2024/0014290