Patent Assignment
Reel/Frame 064688/0288
Assignment of Assignor's Interest
Recorded: 2023-08-24
Pages: 5
Assignors
YOON, YOUNGJUN
Executed: 2023-08-07
CHOI, YUNSEOK
Executed: 2023-08-18
HONG, JONGPA
Executed: 2023-08-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
High Band Width Memory Semiconductor Package
Application:
18/454,278 →
Publication:
US 2024/0222330